Qualcomm will begin sampling LTE chipsets in Q4 2012, the company has announced. The chips will be the first to support both HSPA+ Release 10 and the next-generation of the LTE mobile broadband standard, LTE Advanced, says the company. 

“Our newest generation of Gobi modem chipsets will allow mobile device OEMs to design products that can operate on nearly any mobile broadband network worldwide,” says Cristiano Amon, senior vice president of product management at Qualcomm. “In addition to supporting the latest mobile broadband technologies, these chipsets improve over Qualcomms previous 7-mode 28nm LTE chipsets (MDM9x15) by offering a reduction in power consumption and overall board area, enabling OEMs to design smaller, sleeker devices with longer battery life.”

At Mobile World Congress in Barcelona, Qualcomm is also demonstrating LTE Broadcast – its evolved Multimedia Broadcast Multicast Service (eMBMS) platform. LTE Broadcast is a solution for delivering high-bandwidth, high-demand live premium and software content. 

“Qualcomm is dedicated to the success and adoption of LTE networks worldwide,” says Peggy Johnson, executive vice president and president, global market development at Qualcomm. “With an increasing number of LTE network rollouts, we are continuously working to produce efficient technology solutions focused on optimizing and maximising the consumer experience on these mobile networks.”